Assignment of Assignor's Interest

Recorded: 2015-12-10 Pages: 3

Assignors

KIM, JIN YOUNG

Executed: 2011-11-11

PARK, DOO HYUN

Executed: 2011-11-17

LEE, SEUNG JAE

Executed: 2011-11-11

Assignee

AMKOR TECHNOLOGY, INC.

2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284

Covered Property (1)

Wafer Level Fan Out Package and Method of Fabricating Wafer Level Fan Out Package

Patent: 10,224,217 →

Application: 14/965,617 →

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.