Patent Assignment
Reel/Frame 037268/0933
Assignment of Assignor's Interest
Recorded: 2015-12-11
Pages: 3
Assignors
LEE, CHANG-JAE
Executed: 2015-10-06
KO, TAE-HO
Executed: 2015-10-06
KANG, JUN-HO
Executed: 2015-10-06
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
(MAETAN-DONG) 150, MAEYOUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Flexible Printed Circuit Board and Manufacturing Method Thereof