Flexible printed circuit board and manufacturing method thereof
A flexible printed circuit board and a method of manufacturing the same are disclosed. A flexible printed circuit board having a flexible region and a rigid region includes an inner board layer, an outer board layer laminated on the inner board layer and having a cavity formed in the rigid region, and a laminate exposing a pad in the cavity and laminated on the inner board layer in the rigid region where the pad is formed. The laminate includes a coverlay layer and a copper foil layer arranged so that the coverlay layer faces the inner board layer.
1. A flexible printed circuit board having a flexible region and a rigid region, comprising:
an inner board layer;
an outer board layer laminated on the inner board layer and having a cavity formed in the rigid region; and
a laminate exposing a pad in the cavity and laminated on the inner board layer in the rigid region where the pad is formed,
wherein the laminate comprises a coverlay layer and a copper foil layer arranged so that the coverlay layer faces the inner board layer, and
wherein the laminate is continuously laminated throughout the layer of the rigid region.
2. The flexible printed circuit board of claim 1 , further comprising an electronic device embedded in the cavity and electrically connected to the pad.
3. The flexible printed circuit board of claim 2 , wherein the electronic device comprises a terminal formed at a portion thereof, and
the terminal is electrically connected with the pad through a contact.
4. The flexible printed circuit board of claim 1 , wherein the inner board layer comprises a first insulation layer and an inner circuit layer formed on at least one face of the first insulation layer, and
the outer board layer comprises a second insulation layer laminated on the inner board layer and an outer circuit layer formed on the second insulation layer.
5. The flexible printed circuit board of claim 4 , wherein the flexible region comprises at least a portion of the first insulation layer and at least a portion of the inner circuit layer.
6. The flexible printed circuit board of claim 1 , wherein the coverlay layer comprises a polyimide film and a thermosetting adhesive.
7. The flexible printed circuit board of claim 1 , wherein the cavity is formed by removing a portion of the outer board layer through etching and laser processing, and
the laser processing is performed by using a portion of the copper foil layer of the laminate as a laser mask.
8. The flexible printed circuit board of claim 7 , wherein the flexible region is formed by removing portions of the outer board layer laminated on the inner board layer and the laminate through etching and laser processing.