Patent Assignment
Reel/Frame 037285/0535
Assignment of Assignor's Interest
Recorded: 2015-12-14
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2015-11-27
CHIOU, WEN-CHIH
Executed: 2015-11-27
LIN, YUNG-CHI
Executed: 2015-11-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method and Structure of Three-Dimensional Chip Stacking