Assignment of Assignor's Interest

Recorded: 2015-12-16 Pages: 10

Assignors

LI, LINGZI

Executed: 2015-11-17

LI, ZHAOBING

Executed: 2015-11-17

LU, HUI

Executed: 2015-11-17

SUN, ZHANG HU

Executed: 2015-11-17

Assignee

UNITED MICROELECTRONICS CORP.

NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN

Covered Property (1)

High-Voltage Semiconductor Device with Finger-Shaped Insulation Structure

Patent: 9,553,188 →

Application: 14/970,549 →