Patent Assignment
Reel/Frame 037309/0211
Assignment of Assignor's Interest
Recorded: 2015-12-16
Pages: 2
Assignor
LIN, YAOJIAN
Executed: 2015-12-15
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, TECHPOINT #04-08/09, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Fabricating 3D Package with Short Cycle Time and High Yield