Patent Assignment
Reel/Frame 037322/0505
Assignment of Assignor's Interest
Recorded: 2015-12-17
Pages: 6
Assignors
KIM, KEUNG BEUM
Executed: 2015-11-17
LIM, WONCHUL
Executed: 2015-11-19
KIM, DONGSUK
Executed: 2015-11-13
KIM, YONGHOON
Executed: 2015-11-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Strip Including Conductive Plane Around Periphery of Chip Mounting Regions and Method of Manufacturing Semiconductor Package Using the Same