Patent Assignment
Reel/Frame 037405/0260
Assignment of Assignor's Interest
Recorded: 2015-12-30
Pages: 3
Assignors
HWANG, TAE KYUNG
Executed: 2015-10-13
SOHN, EUN SOOK
Executed: 2015-10-13
KANG, WON JOON
Executed: 2015-10-13
KIM, GI JEONG
Executed: 2015-10-13
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Chip-Scale Electronic Package Structure with Conductive Connective Element Having Increased Surface Area and Laterally Spaced Connection Points for Improved Connectivity
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.