Patent Assignment
Reel/Frame 037419/0219
Assignment of Assignor's Interest
Recorded: 2016-01-06
Pages: 2
Assignee
VIA TECHNOLOGIES, INC.
8F, 533, ZHONGZHENG RD., XINDIAN DIST, NEW TAIPEI CITY, 231, TAIWAN
Covered Property
(1)
Interface Chip and Built-in Self-Test Method Therefor
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.