Patent Assignment
Reel/Frame 053014/0275
Assignment of Assignor's Interest
Recorded: 2020-06-23
Pages: 4
Assignor
VIA TECHNOLOGIES, INC.
Executed: 2020-06-16
Assignee
VIA LABS, INC.
7F, 529-1, ZHONGZHENG RD., XINDIAN DIST., NEW TAIPEI CITY, 231, TAIWAN
Covered Properties
(22)
Universal Serial Bus Device and Universal Serial Bus System
USB Device and Correction Method Thereof
Apparatus Interoperable with Backward Compatible Optical Usb Device
Backward Compatible Optical Usb Device
Processing Device Receiving Different Power During Different States
Transmission System and Method Thereof
A Bridging Device for Connecting to a Host Executes a Power Saving Operation or a Polling Operation According to Status Detected by the Connection Detector
Bridging Device and Power Saving Method Thereof
Rechargeable Battery Module and Battery Charging Method
Battery Management System
Transmittal System and Connection Device
External Electronic Device and Interface Controller and External Electronic Device Control Method
Circuitry and Method for Driving Laser with Temperature Compensation
Optical Transceiver Modules, Optical Transmission Devices, and Optical Transmission Methods
Control Circuit, Connection Line and Control Method Thereof
Interface Chip and Built-in Self-Test Method Therefor
Hub Devices and Methods for Initializing Hub Device
Battery Management System
Operating System and Control Method Thereof
Bridge Device
Energy Regulation Circuit and Operation System Utilizing the Same
Energy Regulation Circuit and Operation System Utilizing the Same
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 30, 2009
From: LIU, MENG-FAN; LIN, YU-LUNG
To: VIA TECHNOLOGIES, INC.
Reel/Frame 023026/0047 →
Assignment of Assignor's Interest
Jan 5, 2010
From: LIN, YU-LUNG
To: VIA TECHNOLOGIES, INC.
Reel/Frame 023733/0663 →
Assignment of Assignor's Interest
Jun 18, 2010
From: LAI, JIIN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 024557/0979 →
Assignment of Assignor's Interest
Jun 18, 2010
From: LAI, JIIN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 024558/0125 →
Assignment of Assignor's Interest
May 5, 2011
From: LIN, WOEI-HARNG
To: VIA TECHNOLOGIES, INC.
Reel/Frame 026231/0396 →
Assignment of Assignor's Interest
Feb 2, 2012
From: HUANG, HSIEN-PO; CHIU, HAO-HSUAN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 027640/0845 →
Assignment of Assignor's Interest
Nov 15, 2012
From: CHEN, WEI-HUNG; LIN, HUI-CHIH
To: VIA TECHNOLOGIES, INC.
Reel/Frame 029304/0509 →
Assignment of Assignor's Interest
Nov 28, 2012
From: CHEN, YEN-CHANG; LIN, HUI-CHIH
To: VIA TECHNOLOGIES, INC.
Reel/Frame 029366/0380 →
Assignment of Assignor's Interest
Jan 18, 2013
From: YEN, SHENG-HSIEN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 029656/0695 →
Assignment of Assignor's Interest
Jun 21, 2013
From: LIN, YI-SHING
To: VIA TECHNOLOGIES, INC.
Reel/Frame 030661/0868 →
Assignment of Assignor's Interest
Oct 4, 2013
From: LEE, SHENG-YUAN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 031351/0088 →
Assignment of Assignor's Interest
Jan 10, 2014
From: KUO, CHIA-YING
To: VIA TECHNOLOGIES, INC.
Reel/Frame 031940/0677 →
Assignment of Assignor's Interest
Jul 23, 2014
From: YING, CHENG-MING; WANG, WEI-YU; WANG, YI-JAN; CHEN, YEN-YU
To: VIA TECHNOLOGIES, INC.
Reel/Frame 033373/0062 →
Assignment of Assignor's Interest
Aug 4, 2014
From: YING, CHENG-MING; LIN, WOEI-HARNG; LIN, YU-LUNG; WANG, WEI-YU
To: VIA TECHNOLOGIES, INC.
Reel/Frame 033454/0344 →
Assignment of Assignor's Interest
Dec 21, 2015
From: YEH, CHENG-CHUN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 037340/0554 →
Assignment of Assignor's Interest
Jan 6, 2016
From: LIN, YU-LUNG; LIN, PO-CHOU
To: VIA TECHNOLOGIES, INC.
Reel/Frame 037419/0219 →
Assignment of Assignor's Interest
May 27, 2016
From: HO, CHIH-LONG; CHEN, YI-TE; CHENG, WEN-HAO; WU, KUO-YU
To: VIA TECHNOLOGIES, INC.
Reel/Frame 038740/0562 →