Patent Assignment
Reel/Frame 037426/0056
Assignment of Assignor's Interest
Recorded: 2016-01-04
Pages: 6
Assignors
DANG, BING
Executed: 2015-12-18
GAYNES, MICHAEL A.
Executed: 2015-12-17
LAURO, PAUL A.
Executed: 2015-12-17
NAH, JAE-WOONG
Executed: 2015-12-17
Assignee
GLOBALFOUNDRIES INC.
PO BOX 309, UGLAND HOUSE, GRAND CAYMAN, KY1-1104, CAYMAN ISLANDS
Covered Property
(1)
Direct Injection Molded Solder Process for Forming Solder Bumps on Wafers
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.