Patent Assignment
Reel/Frame 037446/0887
Assignment of Assignor's Interest
Recorded: 2016-01-10
Pages: 3
Assignor
WANG, YE
Executed: 2012-10-18
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Bond Pad Structure with Dual Passivation Layers
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.