Patent Assignment
Reel/Frame 037453/0143
Assignment of Assignor's Interest
Recorded: 2016-01-11
Pages: 10
Assignors
YU, CHEN-HUA
Executed: 2015-12-28
LIU, CHUNG-SHI
Executed: 2015-12-26
CHENG, MING-DA
Executed: 2015-12-23
LII, MIRNG-JI
Executed: 2015-12-29
CHEN, MENG-TSE
Executed: 2015-12-23
LIN, WEI-HUNG
Executed: 2015-12-23
Assignee
TAIWAN SEMICONDUCTOR MANUFATURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Package on Package Structure and Method for Forming the Same