Package on package structure and method for forming the same
The described embodiments of mechanisms of forming a package on package (PoP) structure involve bonding with connectors with non-solder metal balls to a packaging substrate. The non-solder metal balls may include a solder coating layer. The connectors with non-solder metal balls can maintain substantially the shape of the connectors and control the height of the bonding structures between upper and lower packages. The connectors with non-solder metal balls are also less likely to result in bridging between connectors or disconnection (or cold joint) of bonded connectors. As a result, the pitch of the connectors with non-solder metal balls can be kept small.
1. A semiconductor device package, comprising:
a substrate with a contact pad;
a semiconductor die bonded to the contact pad by a first bonding structure; and
wherein the first bonding structure includes:
a metal ball,
a solder layer over an outer surface of the metal ball, the solder layer having an inner surface and an outer surface which are generally concentric with the outer surface of the metal ball, and
an intermediate layer between the solder layer and the outer surface of the metal ball and separating the outer surface of the metal ball from the inner surface of the solder layer, wherein the intermediate layer is configured to prevent formation of an intermetallic compound between the metal ball and the solder layer, and the intermediate layer comprises titanium;
wherein the metal ball is arranged over and electrically coupled to the contact pad, and wherein the intermediate layer has a first annular thickness on a first portion of the metal ball between the metal ball and the contact pad and has a second annular thickness on a second portion of the metal ball, the second annular thickness being greater than the first annular thickness.
2. The semiconductor device package of claim 1 , wherein a width or diameter of the metal ball is in a range from about 100 μm to about 200 μm.
3. The semiconductor device package of claim 1 , wherein the semiconductor device package has another metal ball next to the metal ball, and a pitch of the metal ball and the another metal ball is in a range from about 150 μm to about 300 μm.
4. The semiconductor device package of claim 1 , wherein the solder layer has a thickness in a range from 0.5 μm to about 10 μm.
5. The semiconductor device package of claim 1 , wherein the intermediate layer has a thickness ranging from about 0.5 μm to about 10 μm.
6. The semiconductor device package of claim 1 , wherein the intermediate layer is a continuous layer that coats the outer surface of the metal ball.
7. An apparatus, comprising:
a substrate;
a package including a first semiconductor die surrounded by a molding compound, wherein the first semiconductor die of the package is bonded to the substrate by a first conductive bonding structure; and
wherein first conductive bonding structure includes:
a metal ball,
a layer of solder over an outer surface of the metal ball, the layer of solder having an inner surface and an outer surface which are generally concentric with the outer surface of the metal ball, and
an intermediate layer separating the metal ball and the layer of solder, wherein the intermediate layer is distinct from both the metal ball and the layer of solder and is configured to prevent formation of an intermetallic compound between the metal ball and the layer of solder;
wherein the intermediate layer has a first annular thickness on a first portion of the metal ball and has a second annular thickness on a second portion of the metal ball, the second annular thickness being greater than the first annular thickness.
8. The apparatus of claim 7 , wherein the intermediate layer comprises titanium, and wherein the metal ball is made of a material selected from a group consisting of: copper, aluminum, silver, gold, nickel, tungsten, alloys thereof, or combinations thereof.
9. The apparatus of claim 7 , wherein the intermediate layer is a continuous layer that coats the outer surface of the metal ball.
10. The apparatus of claim 9 , wherein the layer of solder is a continuous layer that coats an outer surface of the intermediate layer.
11. A solder ball for coupling circuit components, comprising:
a metal ball;
a layer of solder over an outer surface of the metal ball, the layer of solder having an inner surface and an outer surface which are generally concentric with the outer surface of the metal ball; and
an intermediate layer separating the metal ball and the layer of solder, wherein the intermediate layer is distinct in composition from both the metal ball and the layer of solder;
wherein the intermediate layer has a first annular thickness on a first portion of the metal ball and has a second annular thickness on a second portion of the metal ball, the second annular thickness being greater than the first annular thickness.
12. The solder ball of claim 11 , wherein the intermediate layer is configured to prevent formation of an intermetallic compound between the metal ball and the layer of solder.
13. The solder ball of claim 11 , wherein the first portion of the metal ball and second portion of the metal ball are diametrically opposed to one another.
14. The solder ball of claim 11 , wherein the intermediate layer comprises titanium, and wherein the metal ball is made of a non-solder material selected from a group consisting of: copper, aluminum, gold, nickel, tungsten, alloys thereof, or combinations thereof.
15. The solder ball of claim 11 , wherein a width or diameter of the metal ball is in a range from about 100 μm to about 200 μm.
16. The solder ball of claim 11 , wherein the layer of solder has a thickness in a range from 0.5 μm to about 10 μm.
17. The solder ball of claim 11 , wherein the first annular thickness of the intermediate layer ranges from about 0.5 μm to about 10 μm.
18. The semiconductor device package of claim 1 , wherein the metal ball is made of a non-solder material selected from a group consisting of: copper, aluminum, gold, nickel, tungsten, alloys thereof, or combinations thereof.
19. The semiconductor device package of claim 1 , wherein the metal ball is an ovoid; and wherein the metal ball, intermediate layer, and solder layer each have a center that lies along a common axis which extends perpendicularly though an upper surface of the contact pad.
20. The apparatus of claim 7 , wherein the metal ball is an ovoid; and wherein the metal ball, the intermediate layer, and the layer of solder each have a center that lies along a common axis which extends perpendicularly though an upper surface of a contact pad over the substrate.