Patent Assignment
Reel/Frame 037570/0894
Assignment of Assignor's Interest
Recorded: 2016-01-25
Pages: 6
Assignors
KO, YEONG BEOM
Executed: 2015-11-02
KIM, DONG JIN
Executed: 2015-11-02
CHA, SE WOONG
Executed: 2016-01-25
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Wafer-Level Stack Chip Package and Method of Manufacturing the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.