IP Library Assignment 037587/0066
Patent Assignment
Reel/Frame 037587/0066

Assignment of Assignor's Interest

Recorded: 2016-01-26 Pages: 7
Assignors
LEE, DO-SUN
Executed: 2015-12-10
SOHN, CHANG-WOO
Executed: 2015-12-10
KIM, CHUL-SUNG
Executed: 2015-12-10
MAEDA, SHIGENOBU
Executed: 2015-12-18
CHOI, YOUNG-MOON
Executed: 2015-12-10
CHOI, HYO-SEOK
Executed: 2015-12-10
HYUN, SANG-JIN
Executed: 2015-12-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Devices Including Contact Structures That Partially Overlap Silicide Layers
Patent: 9,768,255 →
Application: 15/006,717 →
Publication: US 2016/0308004