Patent Assignment
Reel/Frame 037590/0652
Assignment of Assignor's Interest
Recorded: 2016-01-27
Pages: 5
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Interconnect Structure, Interconnect Layout Structure, and Manufacturing Method Thereof