Interconnect structure, interconnect layout structure, and manufacturing method thereof
An interconnect layout structure having air gaps includes a plurality of air gaps extended along a direction, and at least a first interconnect unit disposed in between the air gaps. The first interconnect unit includes a first conductive line, a first landing mark situated on the first conductive line and a first via structure situated on the first landing mark. The first via structure penetrates the first landing mark and is electrically connected to the first conductive line. And the first landing mark physically separates the air gaps arranged in a straight line.
1. An interconnect layout structure with air gaps comprising:
a plurality of air gaps extended along a first direction from a top view; and
at least a first interconnect unit disposed in between the air gaps, the first interconnect unit comprising:
a first conductive line;
a first landing mark disposed on the first conductive line, and a width of the first landing mark being larger than a distance between the air gaps disposed at two sides of the first conductive line, wherein a long side of the first landing mark extended along a second direction, wherein the first direction is perpendicular to the second direction from the top view; and
a first via structure disposed on the first landing mark, the first via structure penetrating the first landing mark and being electrically connected to the first conductive line.
2. The interconnect layout structure with air gaps according to claim 1 , further comprising a plurality of second conductive lines disposed on at least one side of the first interconnect unit, the second conductive lines are expended along the first direction, and the second conductive lines physically contact the first conductive line.
3. The interconnect layout structure with air gaps according to claim 2 , wherein a width of the first conductive line is larger than a width of the second conductive line.
4. The interconnect layout structure with air gaps according to claim 2 , wherein the first interconnect unit further comprises a plurality of insulating material patterns disposed at two sides of the first conductive line, and the first landing mark of the first interconnect unit overlaps the insulating material patterns.
5. The interconnect layout structure with air gaps according to claim 4 , wherein the insulating material patterns contact the air gaps.
6. The interconnect layout structure with air gaps according to claim 1 , further comprising at least a second interconnect unit, and the second interconnect unit comprising a second conductive line, a second landing mark, and a second via structure.
7. The interconnect layout structure with air gaps according to claim 6 , wherein the first interconnect unit and the second interconnect unit are spaced apart from each other.
8. The interconnect layout structure with air gaps according to claim 6 , wherein first interconnect unit physically contacts the second interconnect unit.
9. The interconnect layout structure with air gaps according to claim 8 , wherein a distance between the first via structure of the first interconnect unit and the second via structure of the second interconnect unit is smaller than a distance between the first via structure and an edge of the first landing mark, and smaller than a distance between the second via structure and an edge of the second landing mark.