Patent Assignment
Reel/Frame 037611/0558
Assignment of Assignor's Interest
Recorded: 2016-01-28
Pages: 20
Assignors
BONILLA, GRISELDA
Executed: 2016-01-28
CHOI, SAMUEL S.
Executed: 2016-01-18
FILIPPI, RONALD G.
Executed: 2016-01-19
HUANG, ELBERT E.
Executed: 2016-01-22
LUSTIG, NAFTALI E.
Executed: 2016-01-17
SIMON, ANDREW H.
Executed: 2016-01-22
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Interconnect Scaling Method Including Forming Dielectric Layer Over Subtractively Etched First Conductive Layer and Forming Second Conductive Material on Dielectric Layer
Patent:
9,502,350 →
Application:
15/009,108 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0557 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Nov 21, 2025
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 073658/0439 →
Change of Name
Nov 21, 2025
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 073658/0823 →