Patent Assignment
Reel/Frame 037615/0517
Assignment of Assignor's Interest
Recorded: 2016-01-29
Pages: 10
Assignors
SUNDARAM, VENKATESH
Executed: 2012-10-19
LIU, FUHAN
Executed: 2012-09-12
TUMMALA, RAO R.
Executed: 2012-10-19
SUKUMARAN, VIJAY
Executed: 2012-10-19
SRIDHARAN, VIVEK
Executed: 2012-10-19
CHEN, QIAO
Executed: 2012-10-19
Assignee
GEORGIA TECH RESEARCH CORPORATION
505 TENTH STREET, NW, ATLANTA, GEORGIA, 30332-0415
Covered Property
(1)
Through-Package-Via (Tpv) Structures on Inorganic Interposer and Methods for Fabricating Same