IP Library › Assignment 037629/0291
Patent Assignment
Reel/Frame 037629/0291

Corrective Assignment to Correct the Filing Date Inside an Assignment. Previously Recorded at Reel: 031888 Frame: 0371. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2016-01-22 Pages: 10
Assignor
DIGITALOPTICS CORPORATION EAST
Executed: 2013-11-12
Assignee
DIGITALOPTICS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (42)
Thin Camera Having Sub-Pixel Resolution
Control of Stray Light in Camera Systems Employing an Optics Stack and Associated Methods
Internal Noise Reducing Structures in Camera Systems Employing an Optics Stack and Associated Methods
Mass Production of Micro-Optical Devices, Corresponding Tools, and Resultant Structures
Optical Device Including at Least One Replicated Surface and Associated Methods
Recessed Optical Surfaces
Folded Optic, Camera System Including the Same, and Associated Methods
Wafer Level Optical Elements and Applications Thereof
Achromatic Optical System Including Diffractive Optical Element
Patent: 5,606,434 →
Application: 08/269,919 →
Optical Disc Player with Molded Diffractive Optical Elements
Patent: 5,825,741 →
Application: 08/677,521 →
Achromatic Optical System Including Diffractive Optical Element, and Method of Forming Same
Patent: 5,774,239 →
Application: 08/771,710 →
Optical Bench Circularizer Having Alignment Indentations and Associated Methods
Patent: 6,157,502 →
Application: 09/347,818 →
Integrated Micro-Optical Systems
Patent: 6,426,829 →
Application: 09/722,710 →
Integration of Array of Non-Rod Shaped Optical Elements with Array of Fibers in a Structure and Associated Methods
Patent: 6,621,976 →
Application: 09/893,457 →
Publication: US 2003/0133687
Method and System for Super Resolution
Patent: 7,003,177 →
Application: 09/937,580 →
Integrated Micro-Optical Systems
Patent: 6,542,281 →
Application: 10/206,095 →
Publication: US 2002/0191273
Compensation and/or Variation of Wafer Level Produced Lenses and Resultant Structures
Patent: 6,836,612 →
Application: 10/698,632 →
Publication: US 2004/0165823
Thin Camera Having Sub-Pixel Resolution
Patent: 7,405,761 →
Application: 10/763,396 →
Publication: US 2005/0073603
Thin Color Camera Having Sub-Pixel Resolution
Patent: 7,773,143 →
Application: 10/949,807 →
Publication: US 2005/0225654
Compensation and/or Variation of Wafer Level Produced Lenses and Resultant Structures
Patent: 6,934,460 →
Application: 10/956,080 →
Publication: US 2005/0047748
Control of stray light in camera systems employing an optics stack and associated methods
Application: 11/600,282 →
Publication: US 2008/0118241
Integrated Optical Imaging Systems Including an Interior Space Between Opposing Substrates and Associated Methods
Patent: 8,153,957 →
Application: 11/928,060 →
Publication: US 2008/0111058
Optical Chassis, Camera Having an Optical Chassis, and Associated Methods
Patent: 7,961,989 →
Application: 11/932,693 →
Publication: US 2008/0251707
Integrated Micro-Optical Systems
Patent: 8,059,345 →
Application: 11/976,260 →
Publication: US 2009/0296228
Internal noise reducing structures in camera systems employing an optics stack and associated methods
Application: 11/984,435 →
Publication: US 2008/0136956
Mass Production of Micro-Optical Devices, Corresponding Tools, and Resultant Structures
Patent: 8,303,866 →
Application: 12/081,871 →
Publication: US 2009/0034088
Method of Forming Thin Camera
Patent: 8,325,266 →
Application: 12/181,173 →
Publication: US 2008/0285965
Optical device including at least one replicated surface and associated methods
Patent: 8,611,026 →
Application: 12/382,944 →
Publication: US 2009/0290833
Wafer Level Optical Elements and Applications Thereof
Patent: 8,422,138 →
Application: 12/497,441 →
Publication: US 2011/0002053
Recessed Optical Surfaces
Patent: 8,189,277 →
Application: 13/050,354 →
Publication: US 2011/0222171
Folded Optic, Camera System Including the Same, and Associated Methods
Patent: 8,391,705 →
Application: 13/288,163 →
Publication: US 2012/0099848
Recessed Optical Surfaces
Patent: 8,687,294 →
Application: 13/481,329 →
Publication: US 2012/0229908
Optical Elements, Method of Replicating Optical Elements, Particularly on a Wafer Level, and Optical Devices
Application: 13/686,511 →
Publication: US 2013/0083397
Wafer Level Optical Elements and Applications Thereof
Patent: 9,030,745 →
Application: 13/863,906 →
Publication: US 2013/0229719
Compensation and/or variation of wafer level produced lenses and resultant structures
Application: 60/267,432 →
Thin camera
Application: 60/507,579 →
Thin camera
Application: 60/560,273 →
Internal noise reducing structures in camera systems employing an optics stack and associated methods
Application: 60/859,519 →
Mass production of micro-optical devices, corresponding tools, and resultant structures
Application: 60/907,936 →
Optical Device Including at Least One Replicated Surface and Associated Methods
Application: 61/040,002 →
Recessed Optical Surfaces Formed On A Substrate
Application: 61/098,188 →
Folded optic for use in a camera system
Application: 61/213,085 →
Related Assignments (11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 23, 2009
From: HAN, HONGTAO; KATHMAN, ALAN; HUANG, RONG; FELDMAN, MICHAEL
To: TESSERA NORTH AMERICA, INC.
Reel/Frame 023576/0843 →
Assignment of Assignor's Interest Nov 23, 2009
From: KINTZ, GREGORY J.; FELDMAN, MICHAEL R.; MORRIS, JAMES E.; ELLIOT, PAUL
To: TESSERA NORTH AMERICA, INC.
Reel/Frame 023577/0061 →
Assignment of Assignor's Interest Jul 11, 2013
From: THE UNIVERSITY OF NORTH CAROLINA AT CHARLOTTE
To: DIGITAL OPTICS CORPORATION
Reel/Frame 030779/0479 →
Assignment of Assignor's Interest Jul 11, 2013
From: DIGITALOPTICS CORPORATION EUROPE LIMITED
To: DIGITALOPTICS CORPORATION EAST
Reel/Frame 030780/0254 →
Assignment of Assignor's Interest Jan 3, 2014
From: DIGITALOPTICS CORPORATION EAST
To: DIGITALOPTICS CORPORATION
Reel/Frame 031888/0371 →
Change of Name Apr 2, 2014
From: TESSERA NORTH AMERICA, INC.
To: DIGITALOPTICS CORPORATION EAST
Reel/Frame 032590/0399 →
Assignment of Assignor's Interest Feb 3, 2015
From: DIGITALOPTICS CORPORATION; DIGITALOPTICS CORPORATION MEMS; FOTONATION LIMITED
To: NAN CHANG O-FILM OPTOELECTRONICS TECHNOLOGY LTD
Reel/Frame 034883/0237 →
Corrective Assignment to Correct the Patent No. 7817833 Previously Recorded at Reel: 027768 Frame: 0541. Assignor(S) Hereby Confirms the Assignment. Oct 1, 2015
From: TESSERA NORTH AMERICA, INC.
To: DIGITALOPTICS CORPORATION EAST
Reel/Frame 036733/0896 →
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →