Patent Assignment
Reel/Frame 037650/0517
Assignment of Assignor's Interest
Recorded: 2016-02-03
Pages: 12
Assignors
HUNG, YU-HSIANG
Executed: 2016-01-29
FU, SSU-I
Executed: 2016-01-29
LIN, CHAO-HUNG
Executed: 2016-01-29
HSU, CHIH-KAI
Executed: 2016-01-29
JENQ, JYH-SHYANG
Executed: 2016-01-29
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Forming the Same