Patent Assignment
Reel/Frame 037686/0621
Assignment of Assignor's Interest
Recorded: 2016-02-02
Pages: 14
Assignors
PAEK, JONG SIK
Executed: 2014-07-24
KIM, JIN YOUNG
Executed: 2014-07-24
KIM, JIN HAN
Executed: 2014-07-30
CHA, SE WOONG
Executed: 2014-07-24
BAE, JAE HUN
Executed: 2014-07-30
KIM, DONG JIN
Executed: 2014-07-28
PARK, DOO HYUN
Executed: 2014-07-24
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Semiconductor Device with Redistribution Layers on Partial Encapsulation and Non-Photosensitive Passivation Layers
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Assignment of Assignor's Interest
Feb 2, 2016
From: PAEK, JONG SIK; KIM, JIN YOUNG; KIM, JIN HAN; CHA, SE WOONG
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 037681/0676 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →
Assignment of Assignor's Interest
Apr 11, 2023
From: KIM, YOONJOO
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 063288/0670 →
Assignment of Assignor's Interest
Apr 12, 2023
From: LEE, SEUNGJAE
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 063299/0856 →