Patent Assignment
Reel/Frame 037688/0307
Assignment of Assignor's Interest
Recorded: 2016-02-08
Pages: 4
Assignor
HIROBE, MASAO
Executed: 2016-01-22
Assignee
J-DEVICES CORPORATION
1913-2 FUKURA, USUKI-CITY, OITA, 8750053, JAPAN
Covered Property
(1)
Semiconductor Device Having Heat Sink Having Stress Absorbing Part
Application:
15/018,563 →
Publication:
US 2016/0233141
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 25, 2020
From: J-DEVICES CO., LTD.
To: AMKOR TECHNOLOGY JAPAN, INC.
Reel/Frame 053597/0184 →
Corrective Assignment to Correct the Conveying Party Name Previously Recorded at Reel: 53597 Frame: 184. Assignor(S) Hereby Confirms the Assignment.
Mar 5, 2021
From: J-DEVICES CORPORATION
To: AMKOR TECHNOLOGY JAPAN, INC.
Reel/Frame 055605/0060 →
Assignment of Assignor's Interest
Oct 27, 2021
From: AMKOR TECHNOLOGY JAPAN, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 057930/0268 →