Patent Assignment
Reel/Frame 037729/0340
Assignment of Assignor's Interest
Recorded: 2016-02-12
Pages: 3
Assignors
CHEAH, BOK ENG
Executed: 2016-01-22
PERIAMAN, SHANGGAR
Executed: 2016-01-25
OOI, KOOI CHI
Executed: 2016-01-25
KONG, JACKSON CHUNG PENG
Executed: 2016-01-22
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Multi-Die Semiconductor Structure with Intermediate Vertical Side Chip and Semiconductor Package for Same