Patent Assignment
Reel/Frame 037750/0187
Assignment of Assignor's Interest
Recorded: 2016-02-17
Pages: 4
Assignor
YAMASHITA, KENJI
Executed: 2015-11-26
Assignee
SUMCO TECHXIV CORPORATION
1324-2, MASURAGAHARA-MACHI, OMURA-SHI,, NAGASAKI, 856-8555, JAPAN
Covered Property
(1)
Method and Device for Polishing Semiconductor Wafer