Patent Assignment
Reel/Frame 037775/0804
Assignment of Assignor's Interest
Recorded: 2016-02-19
Pages: 3
Assignors
LIU, YEN-CHUN
Executed: 2016-02-03
CHANG, HUI-WEN
Executed: 2016-02-03
WANG, MIN-CHIAN
Executed: 2016-02-03
CHIOU, KUO-CHAN
Executed: 2016-02-03
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG, HSINCHU, 31040, TAIWAN
Covered Property
(1)
Thermally Conductive Resin and Thermal Interface Material Comprising the Same