Thermally conductive resin and thermal interface material comprising the same
A thermally conductive resin is provided. The thermally conductive resin has the formula In the formula, X 1 is X 2 is m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is also provided.
1. A thermally conductive resin, represented by formula (I):
wherein
X 1 is
X 2 is
m is an integer ranging from 5 to 30,
n is an integer ranging from 5 to 15, and
o is an integer ranging from 40 to 80, wherein
m:n:o=5-30:5-15:40-80.
2. A thermal interface material comprising a thermally conductive resin as claimed in claim 1 .
3. The thermal interface material as claimed in claim 2 , further comprising thermally conductive powder mixed in the thermal interface material.
4. The thermal interface material as claimed in claim 3 , wherein the thermally conductive powder comprises ceramic powder.
5. The thermal interface material as claimed in claim 3 , wherein the thermally conductive powder comprises boron nitride, silicon carbide, aluminum nitride or aluminum oxide.
6. The thermal interface material as claimed in claim 3 , wherein the thermally conductive powder has a weight ratio less than or equal to 50% in the thermal interface material.