Patent Assignment
Reel/Frame 037873/0978
Assignment of Assignor's Interest
Recorded: 2016-03-02
Pages: 17
Assignors
KIM, JIN YOUNG
Executed: 2013-07-25
PARK, NO SUN
Executed: 2013-07-25
KIM, YOON JOO
Executed: 2013-07-25
KIM, JIN HAN
Executed: 2013-07-25
LEE, SEUNG JAE
Executed: 2013-07-26
KIM, SUNG KYU
Executed: 2013-07-25
CHA, SE WOONG
Executed: 2013-09-03
RINNE, GLENN
Executed: 2013-08-12
LEE, CHOON HEUNG
Executed: 2013-07-30
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →