IP Library › Assignment 037915/0073
Patent Assignment
Reel/Frame 037915/0073

Assignment of Assignor's Interest

Recorded: 2016-02-24 Pages: 5
Assignors
KIM, IN HO
Executed: 2016-02-24
KIM, JAE YUN
Executed: 2016-02-24
SEONG, KYEONG SOOL
Executed: 2016-02-24
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ILLINOIS, 85284
Covered Property (1)
Semiconductor Package and Manufacturing Method Thereof
Patent: 9,780,024 →
Application: 15/052,219 →
Publication: US 2016/0254221
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the First Assignor Execution Date Previously Recorded at Reel: 037915 Frame: 0073. Assignor(S) Hereby Confirms the Assignment. Mar 21, 2016
From: KIM, IN HO; KIM, JAE YUN; SEONG, KYEONG SOOL
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 038190/0192 →
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →