Patent Assignment
Reel/Frame 037966/0035
Assignment of Assignor's Interest
Recorded: 2016-03-14
Pages: 3
Assignor
ISHIZAWA, SHIGERU
Executed: 2016-02-29
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU,, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Substrate Transfer Method and Substrate Processing Apparatus