Substrate transfer method and substrate processing apparatus

1. A substrate transfer method of a substrate processing apparatus that includes

a transfer chamber that transfers a substrate,

a plurality of processing chambers provided around the transfer chamber, each of the processing chambers processing a substrate, and

a load lock chamber provided around the transfer chamber, capable of being selectively retained at between an atmospheric pressure and a vacuum pressure,

the load lock chamber including

a housing provided with a first opening at an atmospheric side, and a second opening connected to the transfer chamber, and

a drive unit that is capable of forming, as a transferring space between the first opening and the second opening, a first space in which a single substrate is capable of being transferred to the transfer chamber via the second opening, and a second space in which a plurality of substrates are capable of being transferred to the transfer chamber via the second opening, in the housing, the first space being smaller than the second space,

the substrate transfer method comprising:

selecting either of the first space or the second space of the load lock chamber in accordance with process statuses of substrates at the plurality of processing chambers, and

controlling the drive unit based on the selected result to form either of the first space or the second space,

wherein the controlling controls the drive unit to select the second space when processing to a plurality of substrates in the plurality of processing chambers, respectively, are finished and transferring the plurality of substrates from the transfer chamber within a predetermined period is performed.

2. The substrate transfer method according to claim 1 ,

wherein in the controlling, controlling the drive unit to select the second space when transferring a plurality of substrates into the plurality of processing chambers within a predetermined period.

3. The substrate transfer method according to claim 1 ,

wherein the second space is configured to include a buffer portion on which the number of substrates same as the number of the plurality of processing chambers are mountable.

4. A substrate processing apparatus comprising:

a transfer chamber that transfers a substrate;

a plurality of processing chambers provided around the transfer chamber, each of the processing chambers processing a substrate;

a load lock chamber, provided around the transfer chamber, capable of being selectively retained at between an atmospheric pressure and a vacuum pressure,

the load lock chamber including

a housing provided with a first opening at an atmospheric side, and a second opening connected to the transfer chamber, and

a drive unit that is capable of forming, as a transferring space between the first opening and the second opening, a first space in which only a single substrate is accommodated and transferred at a time to the transfer chamber via the second opening, and a second space in which a plurality of substrates are capable of being transferred to the transfer chamber via the second opening, in the housing, the first space being smaller than the second space; and

a control unit that selects either of the first space or the second space of the load lock chamber in accordance with process statuses of substrates at the plurality of processing chambers,

wherein the drive unit form either of the first space or the second space based on the selected result, and

wherein the control unit controls the drive unit to select the second space when processing to a plurality of substrates in the plurality of processing chambers, respectively, are finished and transferring the plurality of substrates from the transfer chamber within a predetermined period is performed.

5. The substrate transfer method according to claim 1 ,

wherein the substrate processing apparatus further includes a buffer portion provided in the housing on which the plurality of substrates are mountable,

wherein the second space is formed to include the buffer portion, and

wherein the first space is formed to be separated and sealed from the buffer portion so that the first space is made smaller than the second space.

6. The substrate transfer method according to claim 5 ,

wherein the substrate processing apparatus further includes a stage provided in the housing on which the buffer portion is mounted,

wherein the first space is formed to be separated and sealed from the buffer portion by the stage.

7. The substrate processing apparatus according to claim 4 , further comprising:

a buffer portion provided in the housing on which the plurality of substrates are mountable,

wherein the second space is formed to include the buffer portion, and wherein the first space is formed to be separated and sealed from the buffer portion so that the first space is made smaller than the second space.

8. The substrate processing apparatus according to claim 7 , further comprising:

a stage provided in the housing on which the buffer portion is mounted,

wherein the first space is formed to be separated and sealed from the buffer portion by the stage.

9. The substrate processing apparatus according to claim 4 , wherein the load lock chamber is provided between the transfer chamber and a loader module, and both of the first space and the second space are connected to the loader module through the first opening, and the both of the first space and the second space are connected to the transfer chamber though the second opening.