Patent Assignment
Reel/Frame 037968/0159
Assignment of Assignor's Interest
Recorded: 2016-03-14
Pages: 3
Assignor
KOHIKI, MICHIYA
Executed: 2016-02-24
Assignee
JX NIPPON MINING & METALS CORPORATION
6-3, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, 1008164, JAPAN
Covered Property
(1)
Surface-Treated Copper Foil, Copper Foil with Carrier, Substrate, Resin Substrate, Printed Wiring Board, Copper Clad Laminate and Method for Producing Printed Wiring Board
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.