IP Library Assignment 037974/0505
Patent Assignment
Reel/Frame 037974/0505

Corrective Assignment to Correct the Attorney Docket Number Previously Recorded at Reel: 037369 Frame: 0202. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2016-03-02 Pages: 7
Assignors
SHEN, HONG
Executed: 2014-07-10
WOYCHIK, CHARLES
Executed: 2014-07-09
SITARAM, ARKALGUD
Executed: 2014-07-10
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Microelectronic Assemblies with Integrated Circuits and Interposers with Cavities, and Methods of Manufacture
Patent: 9,536,862 →
Application: 14/980,996 →
Publication: US 2016/0133600
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 28, 2015
From: SHEN, HONG; WOYCHIK, CHARLES; SITARAM, ARKALGUD
To: INVENSAS CORPORATION
Reel/Frame 037369/0202 →
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073508/0668 →
Change of Name Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0751 →