Patent Assignment
Reel/Frame 038035/0461
Assignment of Assignor's Interest
Recorded: 2016-03-18
Pages: 3
Assignors
KOJIMA, KIYOSHI
Executed: 2015-10-05
NAKABAYASHI, MASASHI
Executed: 2015-10-05
SHIMOMURA, KOTA
Executed: 2015-10-05
NAGAHATA, YUKIO
Executed: 2015-10-05
Assignee
NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
5319, OAZA YODO, YORII-MACHI, OSATO-GUN, SAITAMA, 369-1201, JAPAN
Covered Property
(1)
Method for Evaluating Internal Stress of Silicon Carbide Monocrystalline Wafer and Method for Predicting Warpage in Silicone Carbide Monocrystalline Wafer
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Assignee Address Previously Recorded on Reel 038035 Frame 0461. Assignor(S) Hereby Confirms the Assignment.
Feb 22, 2018
From: KOJIMA, KIYOSHI; NAKABAYASHI, MASASHI; SHIMOMURA, KOTA; NAGAHATA, YUKIO
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 045416/0684 →
Assignment of Assignor's Interest
Apr 16, 2018
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
To: SHOWA DENKO K.K.
Reel/Frame 045553/0508 →
Change of Name
Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →