IP Library Assignment 045553/0508
Patent Assignment
Reel/Frame 045553/0508

Assignment of Assignor's Interest

Recorded: 2018-04-16 Pages: 3
Assignor
Assignee
SHOWA DENKO K.K.
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property (1)
Method for Evaluating Internal Stress of Silicon Carbide Monocrystalline Wafer and Method for Predicting Warpage in Silicone Carbide Monocrystalline Wafer
Application: 15/023,254 →
Publication: US 2016/0231256
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 18, 2016
From: KOJIMA, KIYOSHI; NAKABAYASHI, MASASHI; SHIMOMURA, KOTA; NAGAHATA, YUKIO
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 038035/0461 →
Corrective Assignment to Correct the Assignee Address Previously Recorded on Reel 038035 Frame 0461. Assignor(S) Hereby Confirms the Assignment. Feb 22, 2018
From: KOJIMA, KIYOSHI; NAKABAYASHI, MASASHI; SHIMOMURA, KOTA; NAGAHATA, YUKIO
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 045416/0684 →
Change of Name Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →