Patent Assignment
Reel/Frame 038072/0951
Assignment of Assignor's Interest
Recorded: 2016-03-22
Pages: 4
Assignors
TSAI, YU-YI
Executed: 2016-03-08
HO, WEN-PIN
Executed: 2016-03-08
LEE, CHIEH-HAN
Executed: 2016-03-08
CHAO, YU-HSIANG
Executed: 2016-03-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Chemical Mechanical Polishing System and Method for Polishing Wafer