IP Library › Assignment 038143/0301
Patent Assignment
Reel/Frame 038143/0301

Merger and Change of Name

Recorded: 2016-03-30 Pages: 6
Assignors
Assignee
INFINEON TECHNOLOGIES AMERICAS CORP.
101 N. SEPULVEDA BLVD., EL SEGUNDO, CALIFORNIA, 90245
Covered Property (1)
Methods of Combining Silicon and Iii-Nitride Material on a Single Wafer
Patent: 8,866,190 →
Application: 11/452,549 →
Publication: US 2006/0289876
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 7, 2006
From: BRIERE, MIKE
To: INTERNATIONAL RECTIFIER CORPORATION
Reel/Frame 018257/0785 →
Assignment of Assignor's Interest Jun 14, 2016
From: INFINEON TECHNOLOGIES AMERICAS CORP.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 038993/0104 →