Methods of combining silicon and III-nitride material on a single wafer

1. An integrated semiconductor device, comprising:

a common semiconductor substrate;

a first semiconductor device comprising a control IC formed over a surface of the common semiconductor substrate; and

a second semiconductor device comprising a power switching device formed over the surface of the common semiconductor substrate and disposed lateral to the first semiconductor device;

wherein the first semiconductor device includes a first semiconductor body comprised of a first semiconductor body material, and the second semiconductor device includes a second semiconductor body comprised of a second semiconductor body material having a higher band gap than the first semiconductor body material, and wherein the control IC is in the first semiconductor body and said power switching device is controlled by said control IC, said control IC being formed in only one semiconductor body.

2. The integrated semiconductor device of claim 1 , wherein the first semiconductor body material is silicon and the second semiconductor body material is a III-N semiconductor.

3. The integrated semiconductor device of claim 1 , further comprising an insulation wall disposed between the first semiconductor device and the second semiconductor device.

4. The integrated semiconductor device of claim 1 , further comprising an interlayer disposed between the second semiconductor device and the common semiconductor substrate.

5. The integrated semiconductor device of claim 1 , wherein the common semiconductor substrate is comprised of silicon, the first semiconductor body material is comprised of silicon, the second semiconductor body material is comprised of a III-N semiconductor, and further comprising an interlayer comprised of a compositionally graded III-N material disposed between the second semiconductor device and the common semiconductor substrate, and an insulation wall comprised of silicon dioxide between the first semiconductor device and the second semiconductor device.

6. The integrated semiconductor device of claim 1 , wherein the first semiconductor body is comprised of <100> silicon.

7. The integrated semiconductor device of claim 1 , wherein the first semiconductor body is comprised of <100> silicon and the common semiconductor substrate is comprised of <100> silicon.

8. The integrated semiconductor device of claim 1 , wherein the second semiconductor body is comprised of a III-N semiconductor body material that is formed on <111> silicon.

9. The integrated semiconductor device of claim 1 , wherein the second semiconductor device is comprised of a III-nitride heterojunction.

10. The integrated semiconductor device of claim 9 , wherein said heterojunction includes a first III-nitride semiconductor body comprised of a first semiconductor alloy from the InAlGaN system and a second III-nitride semiconductor body comprised of a second semiconductor alloy from the InAlGaN system.

11. The integrated semiconductor device of claim 10 , wherein the first semiconductor alloy is GaN, and the second semiconductor alloy is AlGaN.

12. An integrated semiconductor wafer, comprising:

a common semiconductor substrate;

a plurality of first semiconductor devices formed over a surface of said common semiconductor substrate; and

a plurality of second semiconductor devices formed over said surface of said common semiconductor substrate and each disposed lateral to at least one of said plurality of first semiconductor devices;

wherein said plurality of first semiconductor devices each include a control IC in a first semiconductor body comprised of a first semiconductor body material, and said plurality of second semiconductor devices each include a power switching device in a second semiconductor body comprised of a second semiconductor body material having a higher band gap than said first semiconductor body material, said control IC being formed in only one semiconductor body.

13. The integrated semiconductor wafer of claim 12 , wherein said first semiconductor body material comprises silicon and said second semiconductor body material comprises a III-N semiconductor.

14. The integrated semiconductor wafer of claim 12 , further comprising a plurality of first interlayers, each disposed between a respective second semiconductor device and said common semiconductor substrate.

15. The integrated semiconductor wafer of claim 14 , further comprising a plurality of second interlayers, each disposed over a respective first interlayer.

16. The integrated semiconductor wafer of claim 12 , wherein said first semiconductor body material comprises <100> silicon, said common substrate comprises <100> silicon, and said plurality of second interlayers comprise <111> silicon.

17. The integrated semiconductor wafer of claim 12 , wherein said plurality of second semiconductor devices comprise High Electron Mobility Transistors.

18. An integrated semiconductor device, comprising:

a common semiconductor substrate;

a control IC formed over a surface of said common semiconductor substrate; and

a High Electron Mobility Transistor formed over said surface of said common semiconductor substrate and disposed lateral to said control IC;

wherein said control IC is in a silicon semiconductor body, and said High Electron Mobility Transistor is in of a III-N semiconductor body, and wherein said High Electron Mobility Transistor is controlled by said control IC, said control IC being formed in only one semiconductor body.

19. The integrated semiconductor device of claim 18 , wherein said High Electron Mobility Transistor further comprises AlGaN disposed on said III-N semiconductor body.

20. The integrated semiconductor device of claim 18 , wherein said silicon semiconductor body comprises <100> silicon, said common substrate comprises <100> silicon, and said III-N semiconductor body is formed on an interlayer comprised of <111> silicon.