IP Library › Assignment 038993/0104
Patent Assignment
Reel/Frame 038993/0104

Assignment of Assignor's Interest

Recorded: 2016-06-14 Pages: 3
Assignor
Assignee
SAMSUNG ELECTRONICS CO., LTD.
SEONGCHON-GIL 33, SEOCHO-GU, SEOUL, 06765, KOREA, REPUBLIC OF
Covered Property (1)
Methods of Combining Silicon and Iii-Nitride Material on a Single Wafer
Patent: 8,866,190 →
Application: 11/452,549 →
Publication: US 2006/0289876
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 7, 2006
From: BRIERE, MIKE
To: INTERNATIONAL RECTIFIER CORPORATION
Reel/Frame 018257/0785 →
Merger and Change of Name Mar 30, 2016
From: INTERNATIONAL RECTIFIER CORPORATION; INFINEON TECHNOLOGIES AMERICAS CORP.
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 038143/0301 →