Patent Assignment
Reel/Frame 038336/0926
Assignment of Assignor's Interest
Recorded: 2016-04-20
Pages: 4
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Method of Forming a Semiconductor Package with Conductive Interconnect Frame and Structure
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.