Patent Assignment
Reel/Frame 038541/0115
Assignment of Assignor's Interest
Recorded: 2016-05-10
Pages: 4
Assignor
LEE, CHOON HEUNG
Executed: 2016-05-10
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Method for Fabricating Semiconductor Package Having a Multi-Layer Molded Conductive Substrate and Structure
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 19, 2016
From: BANG, WON BAE; YOON, JU HOON; CHUNG, JI YOUNG; KIM, BYONG JIN
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 038471/0818 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Mar 5, 2022
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 059323/0358 →