IP Library › Assignment 038552/0708
Patent Assignment
Reel/Frame 038552/0708

Assignment of Assignor's Interest

Recorded: 2016-05-11 Pages: 4
Assignors
CHANG, CHIH-HAO
Executed: 2016-03-16
CHIANG, TSUNG-HSIEN
Executed: 2016-03-10
CHEN, GUAN-YU
Executed: 2016-03-16
CHANG, WEI SEN
Executed: 2016-03-18
KUO, TIN-HAO
Executed: 2016-03-18
TSAI, HAO-YI
Executed: 2016-03-11
YU, CHEN-HUA
Executed: 2016-04-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Interconnect Structures for Wafer Level Package and Methods of Forming Same
Patent: 9,659,896 →
Application: 15/052,105 →
Publication: US 2016/0172329
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Title Inside the Assignment Document Previously Recorded at Reel: 038552 Frame: 0708. Assignor(S) Hereby Confirms the Assignment. Dec 14, 2016
From: CHANG, CHI-HAO; CHIANG, TSUNG-HSIEN; CHEN, GUAN-YU; CHANG, WEI SEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 040922/0101 →