Patent Assignment
Reel/Frame 038655/0917
Assignment of Assignor's Interest
Recorded: 2016-05-20
Pages: 3
Assignors
EID, FERAS
Executed: 2016-05-13
SANKMAN, ROBERT L.
Executed: 2016-05-13
SANE, SANDEEP B.
Executed: 2016-05-13
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Microelectronic Bond Pads Having Integrated Spring Structures