Microelectronic bond pads having integrated spring structures
A microelectronic package may be fabricated with at least one compliant external bond pad having at least one integrated spring structure for mitigating the effects of warpage of the microelectronic package during attachment to an external substrate. An embodiment for the microelectronic package may include a microelectronic package substrate having a first surface and an opposing second surface, wherein the microelectronic package substrate includes a void defined therein that extends into the microelectronic package substrate from the second surface thereof, and a compliant bond pad suspended over the void, wherein the compliant bond pad includes a land portion and at least one spring portion, and wherein the at least one spring portion extends from the compliant bond pad land portion to an anchor structure on the microelectronic package substrate second surface.
1. A microelectronic structure, comprising:
a microelectronic package substrate having a first surface and an opposing second surface, wherein the microelectronic package substrate includes a void defined therein that extends into the microelectronic package substrate from the second surface thereof; and
a compliant bond pad suspended over the void, wherein the compliant bond pad includes a land portion and at least one spring portion, and wherein the at least one spring portion extends from the compliant bond pad land portion to an anchor structure on the microelectronic package substrate second surface; wherein the at least one spring portion only contacts the compliant bond pad land portion and the anchor structure and wherein the at least one compliant bond pad spring portion comprises a spiral circling the compliant bond pad land portion.
2. The microelectronic structure of claim 1 , further comprising an external interconnect on the compliant bond pad land portion.
3. The microelectronic structure of claim 2 , wherein the external interconnect comprises solder.
4. The microelectronic structure of claim 2 , further comprising an external substrate wherein the external interconnect is electrically connected to the external substrate.
5. The microelectronic structure of claim 4 , wherein the microelectronic package substrate is warped relative to the external substrate.
6. The microelectronic structure of claim 4 , further comprising an adhesive material disposed on the compliant bond pad between the microelectronic package substrate and the external substrate.
7. The microelectronic structure of claim 1 , further comprising at least one microelectronic die electrically connected to the microelectronic package substrate first surface.
8. The microelectronic structure of claim 1 , wherein the compliant bond pad land portion includes a plurality of openings extending through the compliant bond pad land portion.
9. The microelectronic structure of claim 1 , wherein the at least one compliant bond pad spring portion is non-linear.
10. A computing device, comprising:
a board; and
a microelectronic package attached to the board, wherein the microelectronic package includes:
a microelectronic package substrate having a first surface and an opposing second surface, wherein the microelectronic package substrate includes a void defined therein that extends into the microelectronic package substrate from the second surface thereof;
a compliant bond pad suspended over the void, wherein the compliant bond pad includes a land portion and at least one spring portion, wherein the at least one spring portion extends from the compliant bond pad land portion to an anchor structure on the microelectronic package substrate second surface, wherein the at least one compliant bond pad spring portion comprises a spiral circling the compliant bond pad land portion, and wherein the at least one spring portion only contacts the compliant bond pad land portion and the anchor structure; and
an external interconnect electrically connected between the compliant bond pad land portion and the board.
11. The computing device of claim 10 , wherein the external interconnect comprises solder.
12. The computing device of claim 10 , further comprising an adhesive material disposed on the compliant bond pad between the microelectronic package substrate and the external substrate.
13. The computing device of claim 10 , further comprising at least one microelectronic die electrically connected to the microelectronic package substrate first surface.
14. The computing device of claim 10 , wherein the compliant bond pad land portion includes a plurality of openings extending through the compliant bond pad land portion.
15. The computing device of claim 10 , wherein the microelectronic package substrate is warped relative to the external substrate.
16. The computing device of claim 10 , wherein the at least one compliant bond pad spring portion is non-linear.