Assignment of Assignor's Interest

Recorded: 2016-05-26 Pages: 2

Assignor

YAP, WENG FOONG

Executed: 2016-05-25

Assignee

FREESCALE SEMICONDUCTOR INC.

6501 WILLIAM CANNON DRIVE WEST, AUSTIN, TEXAS, 78735

Covered Property (1)

Integrated Circuit Package with Solder Balls on Two Sides

Application: 15/165,511 →

Publication: US 2017/0345746

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.