INTEGRATED CIRCUIT PACKAGE WITH SOLDER BALLS ON TWO SIDES

1 . A method of making an integrated circuit package, the method comprising:

forming a work piece panel, wherein the work piece panel includes an encapsulated panel that includes encapsulant and a plurality of die encapsulated in the encapsulated panel, wherein for each die of the plurality of die, for at least two sides of the die, encapsulant of the encapsulated panel is located next to the side in a direction orthogonal from the side and extending out away from the die from the side;

independently attaching a first plurality of solder balls to a first major side of the work piece panel;

independently attaching a second plurality of solder balls to a second major side of the work piece panel, the second major side being opposite the first major side;

after the independently attaching the first plurality of solder balls and the independently attaching the second plurality of solder balls, singulating the work piece panel into a plurality of integrated circuit packages, wherein each of the plurality of integrated circuit packages includes at least one die of the plurality of die, at least one solder ball of the first plurality of solder balls that is unencapsulated, and at least one solder ball of the second plurality of solder balls that is unencapsulated.

2 . The method of claim 1 wherein the independently attaching the first plurality of solder balls includes applying the first plurality of solder balls to electrically conductive surfaces of the first major side of the work piece panel and reflowing the first plurality of solder balls to bond to the electrically conductive surfaces.

3 . The method of claim 1 further comprising:

after the independently attaching the first plurality of solder balls, placing the work piece panel on a carrier with the first major side facing the carrier, wherein the independently attaching the second plurality of solder balls is performed while the work piece panel is on the carrier.

4 . A method of making an integrated circuit package, the method comprising: forming a work piece panel,

wherein the work piece panel includes an encapsulated panel that includes encapsulant and a plurality of die encapsulated in the encapsulated panel, wherein for each die of the plurality of die, for at least two sides of the die, encapsulant of the encapsulated panel is located next to the side in a direction orthogonal from the side and extending out away from the die from the side;

independently attaching a first plurality of solder balls to a first major side of the work piece panel;

independently attaching a second plurality of solder balls to a second major side of the work piece panel, the second major side being opposite the first major side;

after the independently attaching the first plurality of solder balls and the independently attaching the second plurality of solder balls, singulating the work piece panel into a plurality of integrated circuit packages, wherein each of the plurality of integrated circuit packages includes at least one die of the plurality of die, at least one solder ball of the first plurality of solder balls, and at least one solder ball of the second plurality of solder balls;

after the independently attaching the first plurality of solder balls, placing the work piece panel on a carrier with the first major side facing the carrier, wherein the independently attaching the second plurality of solder balls is performed while the work piece panel is on the carrier;

wherein the carrier includes at least one opening wherein the first plurality of solder balls are located in the at least one opening when the work piece panel is on the carrier.

5 . The method of claim 3 wherein a thickness of the carrier is greater than a distance of a furthest surface of the first plurality of solder balls from the first major side of the work piece panel.

6 . The method of claim 1 , wherein the forming the work piece panel includes forming a redistribution structure on a first major side of the encapsulated panel, the redistribution structure includes electrically conductive structures electrically coupled to electrically conductive structures of the plurality of die, wherein the independently attaching the first plurality of solder balls includes independently attaching the first plurality of solder balls to conductive surfaces of the redistribution structure.

7 . The method of claim 1 wherein the encapsulated panel includes a plurality of encapsulated electrically conductive structures, wherein after singulation, each integrated circuit package of the plurality of integrated circuit packages includes at least one electrically conductive structure of the plurality of electrically conductive structures that is coupled to a solder ball of the first plurality of solder balls and a second solder ball of the second plurality of solder balls.

8 . The method of claim 1 wherein after singulation, each integrated circuit package of the plurality of integrated circuit packages includes at least at least two die.

9 . The method of claim 8 , wherein a first die of the at least two die includes a processor and a second die of the at least two die includes a memory device, wherein the processor is operably coupled to the memory device.

10 . The method of claim 1 further comprising:

after the singulating, attaching a first structure to a first major side of the integrated package wherein the attaching includes reflowing the at least one solder ball of the first plurality of solder balls to bond to at least one electrically conductive structure of the first structure, wherein the reflowing electrically couples a die of the at least one die to an electrically conductive structure of the first structure through a solder ball of the at least one solder ball that was reflowed.

11 . The method of claim 10 wherein the first structure includes an integrated circuit die, wherein the die of the least one die is electrically coupled to the integrated circuit die through a reflowed solder ball of the first plurality of solder balls.

12 . The method of claim 10 wherein the first structure includes a sensor, wherein the die of the least one die is electrically coupled to the sensor through a reflowed solder ball of the first plurality of solder balls.

13 . The method of claim 10 , wherein:

after the singulating, attaching a second structure to a second major side of the integrated circuit package, the second major side of the integrated circuit package is opposite the first major side of the integrated circuit package wherein the attaching the second structure includes reflowing the at least one solder ball of the second plurality of solder balls to bond to at least one electrically conductive structure of the second structure, wherein the reflowing electrically couples the die of the at least one die to an electrically conductive structure of the second structure through a solder ball of the at least one solder ball of the second plurality of solder balls that was reflowed.

14 . The method of claim 13 wherein the second structure is characterized as a circuit board.

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20 . A method of making an integrated circuit package, the method comprising:

forming a work piece panel, wherein the work piece panel includes an encapsulated panel that includes encapsulant and a plurality of die encapsulated in the encapsulated panel, wherein for each die of the plurality of die, for at least two sides of the die, encapsulant of the encapsulated panel is located next to the side in a direction orthogonal from the side and extending out away from the die from the side;

applying heat to the work piece panel to bond a first plurality of solder balls to a first major side of the work piece panel, wherein as a result of the applying heat, the first plurality of solder balls are only bonded to the work piece panel;

applying heat to the work piece panel to bond a second plurality of solder balls to a second major side of the work piece panel, wherein as a result of the applying heat, the second plurality of solder balls are only bonded to the work piece panel;

after the applying heat to the work piece panel to bond a first plurality of solder balls and the applying heat to the work piece panel to bond a second plurality of solder balls, singulating the work piece panel into a plurality of integrated circuit packages, wherein each of the plurality of integrated circuit packages includes at least one die of the plurality of die, at least one solder ball of the first plurality of solder balls that is unencapsulated, and at least one solder ball of the second plurality of solder balls that is unencapsulated.