Patent Assignment
Reel/Frame 038748/0825
Assignment of Assignor's Interest
Recorded: 2016-05-31
Pages: 7
Assignors
LIN, YUSHENG
Executed: 2016-05-25
WANG, SOON WEI
Executed: 2016-05-24
CHEW, CHEE HIONG
Executed: 2016-05-24
CARNEY, FRANCIS J.
Executed: 2016-05-25
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Polymer Resin and Compression Mold Chip Scale Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Dec 23, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 041187/0295 →
Release of Security Interest in Patents Recorded at Reel 041187, Frame 0295
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064151/0203 →