Patent Assignment
Reel/Frame 038769/0245
Assignment of Assignor's Interest
Recorded: 2016-06-01
Pages: 3
Assignor
LIOU, EN-CHIUAN
Executed: 2014-12-01
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Method for Fabricating Semiconductor Device Having Fin Structure That Includes Dummy Fins
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.