Patent Assignment
Reel/Frame 038769/0650
Assignment of Assignor's Interest
Recorded: 2016-06-02
Pages: 12
Assignors
HSU, CHIH-KAI
Executed: 2016-05-27
HUNG, YU-HSIANG
Executed: 2016-05-27
CHENG, WEI-CHI
Executed: 2016-05-27
FU, SSU-I
Executed: 2016-05-27
JENQ, JYH-SHYANG
Executed: 2016-05-27
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Device and Method for Fabricating the Same